DocumentCode
668941
Title
In-depth analysis of power noise coupling between core and periphery power rails
Author
Guang Chen ; WernShin Choo ; Shishuang Sun ; Dan Oh
Author_Institution
Altera Corp., San Jose, CA, USA
fYear
2013
fDate
27-30 Oct. 2013
Firstpage
211
Lastpage
214
Abstract
Core and periphery digital blocks often use the same voltage level. Due to the large current drawn by core, shielding periphery power from core power noise is highly desirable. This paper presents various separation schemes and compares pros and cons. Fundamental power noise coupling mechanisms between core and periphery powers are described in detail. Two major sources of power noise coupling are studied: inductive noise coupling and direct current draw through a common share point. Based on this analysis, we propose cost optimized board decoupling schemes.
Keywords
CMOS integrated circuits; coupled circuits; field programmable gate arrays; integrated circuit interconnections; integrated circuit noise; printed circuit interconnections; printed circuits; core power noise; cost optimized board decoupling schemes; direct current; in depth analysis; inductive noise coupling; periphery digital blocks; periphery power rails; power noise coupling; Capacitors; Couplings; Ferrites; Impedance; Inductance; Noise; Rails; core and periphery power coupling; ferrite bead; power integrity; power separation; power transfer noise;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
Conference_Location
San Jose, CA
Print_ISBN
978-1-4799-0705-2
Type
conf
DOI
10.1109/EPEPS.2013.6703501
Filename
6703501
Link To Document