Characterization of TSVs by cascaded daisy chains

Author

Yi-Chen Wu ; Kai-Bin Wu ; Kang-Yun Yang ; Ting-Yi Huang ; Ruey-Beei Wu

Author_Institution

Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan

fYear

2013

fDate

27-30 Oct. 2013

Firstpage

251

Lastpage

254

Abstract

The Characterization of stacked TSVs is difficult because of expensive experiments and low feasibility. In addition, the calibration of transmission lines connecting TSVs and coupling among TSVs is the main obstacle when horizontally connected TSVs are measured. Therefore, the equivalent transmission matrix of the coupling effect between two adjacent TSVs is derived, and a set of test structures is proposed to extract characteristics of a signal TSV. Under weak coupling conditions, the effect caused by transmission lines and coupling among signals can be eliminated by a calibration mechanism. Hence, extraction results can be used to predict the electrical behavior of stacked TSVs, and experiments are inexpensive and feasible.

Keywords

calibration; electronics packaging; multiconductor transmission lines; three-dimensional integrated circuits; calibration; cascaded daisy chains; equivalent transmission matrix; stacked TSV; transmission lines; weak coupling conditions; Calibration; Couplings; Metals; Power transmission lines; Silicon; Through-silicon vias; Transmission line matrix methods; calibration; characterization; coupling; equivalent transmission matrix;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on

Conference_Location

San Jose, CA

Print_ISBN

978-1-4799-0705-2

Type

conf

DOI

10.1109/EPEPS.2013.6703511

Filename

6703511