Title :
Characterization of TSVs by cascaded daisy chains
Author :
Yi-Chen Wu ; Kai-Bin Wu ; Kang-Yun Yang ; Ting-Yi Huang ; Ruey-Beei Wu
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
The Characterization of stacked TSVs is difficult because of expensive experiments and low feasibility. In addition, the calibration of transmission lines connecting TSVs and coupling among TSVs is the main obstacle when horizontally connected TSVs are measured. Therefore, the equivalent transmission matrix of the coupling effect between two adjacent TSVs is derived, and a set of test structures is proposed to extract characteristics of a signal TSV. Under weak coupling conditions, the effect caused by transmission lines and coupling among signals can be eliminated by a calibration mechanism. Hence, extraction results can be used to predict the electrical behavior of stacked TSVs, and experiments are inexpensive and feasible.
Keywords :
calibration; electronics packaging; multiconductor transmission lines; three-dimensional integrated circuits; calibration; cascaded daisy chains; equivalent transmission matrix; stacked TSV; transmission lines; weak coupling conditions; Calibration; Couplings; Metals; Power transmission lines; Silicon; Through-silicon vias; Transmission line matrix methods; calibration; characterization; coupling; equivalent transmission matrix;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-0705-2
DOI :
10.1109/EPEPS.2013.6703511
