DocumentCode :
668952
Title :
Design and verification of SMT MMIC package using a 20 GHz LNA, a 40 GHz LNA and a 40GHz digital attenuator
Author :
Inkwon Ju ; In-Bok Yom ; Keun Kwan Ryu
Author_Institution :
Satellite & Wireless Convergence Res. Dept., Electron. & Telecommun. Res. Inst., Daejeon, South Korea
fYear :
2013
fDate :
27-30 Oct. 2013
Firstpage :
255
Lastpage :
258
Abstract :
A surface mounting (SMT) low temperature cofired ceramic (LTCC) MMIC package was developed using new vertical transition consist of a trough line, a slab line, and shielded multilayer coplanar waveguides (SMCPWs) for DC to 50 GHz band applications. A 20 GHz LNA, a 40 GHz LNA and a 40 GHz 5-bit digital attenuator were packaged to verify the performances of the developed LTCC SMT MMIC package. The packaged 20 GHz LNA has less than 0.3 dB gain degradation, compared with the on-wafer measurement. The packaged 40 GHz LNA has some differences with on-wafer measurement due to the size mismatch with the MMIC package. The packaged 40 GHz attenuator exhibits a negligible degradation of the attenuation accuracy, compared to the on-wafer results.
Keywords :
MMIC; attenuators; ceramic packaging; coplanar waveguides; electromagnetic shielding; integrated circuit design; low noise amplifiers; microwave amplifiers; surface mount technology; waveguide transitions; LNA; LTCC SMT MMIC package; digital attenuator; frequency 0 GHz to 50 GHz; frequency 20 GHz; frequency 40 GHz; low temperature cofired ceramic; shielded multilayer coplanar waveguides; size mismatch; slab line; surface mount technology; trough line; vertical transition; Attenuators; Bonding; Libraries; MMICs; Metals; Slabs; Wires; Integrated circuit packaging; ceramics; interconnections; surface mounting;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-0705-2
Type :
conf
DOI :
10.1109/EPEPS.2013.6703512
Filename :
6703512
Link To Document :
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