DocumentCode :
670662
Title :
Achieving energy efficiency by HW/SW co-design
Author :
Borkar, Shekhar
Author_Institution :
Intel Corp, Hillsboro, OR, USA
fYear :
2013
fDate :
28-29 Oct. 2013
Firstpage :
1
Lastpage :
1
Abstract :
Summary form only given. Compute performance increased by orders of magnitude in the last few decades, made possible by continued technology scaling, increasing frequency, providing integration capacity to realize novel architectures, and reducing energy to keep power dissipation within limit. The technology treadmill will continue, and one would expect to reach Exascale level performance this decade; however, it´s the same Physics that helped you in the past will now pose some barriers-Business as usual will not be an option. The energy and power will pose as a major challenge- an Exascale machine would consume in excess of a Giga-watt! Memory & communication bandwidth with conventional technology would be prohibitive. Orders of magnitude increased parallelism, let alone extreme parallelism due to energy saving techniques, would increase unreliability. And programming system will be posed with even severe challenge of harnessing the performance with concurrency. We will discuss potential solutions in all disciplines, such as circuit design, system architecture, system software, programming system, and resiliency to pave the road towards Exascale performance.
Keywords :
hardware-software codesign; low-power electronics; parallel programming; power aware computing; Exascale level performance; Exascale machine; HW-SW codesign; circuit design; communication bandwidth; energy efficiency; energy saving techniques; hardware-software co-design; integration capacity; memory; power dissipation; programming system; system architecture; system software; technology scaling; Decision support systems; Energy efficiency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Efficient Electronic Systems (E3S), 2013 Third Berkeley Symposium on
Conference_Location :
Berkeley, CA
Type :
conf
DOI :
10.1109/E3S.2013.6705856
Filename :
6705856
Link To Document :
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