DocumentCode :
671127
Title :
Finite element modeling of SAW resonator in CMOS technology for single and double interdigitated electrode (IDT) structure
Author :
Aini Md Ralib, Aliza ; Nordin, A.N. ; Hashim, U.
Author_Institution :
Dept. of Electr. & Comput. Eng., Int. Islamic Univ. Malaysia, Kuala Lumpur, Malaysia
fYear :
2013
fDate :
25-27 Sept. 2013
Firstpage :
1
Lastpage :
4
Abstract :
The performance of surface acoustic wave resonator in CMOS technology for single and double electrode (IDT) structure is presented. Interdigitated electrodes (IDT) structure in surface acoustic wave (SAW) resonator is the most crucial component for excitation of SAW devices. Possible configurations for the IDT are single electrode and double electrode. The performance of the resonator for single and double electrode is compared at a frequency range of 0.5 GHz to 1 GHz. 2D Finite element modeling of the CMOS SAW resonator was simulated using COMSOL Multiphysics® for three step analysis eigen frequency, frequency domain and time domain analysis. The structure and dimension of the device is based on 0.18 μm RF CMOS process where the pattern of IDT is fabricated using standard CMOS fabrication process. The simulated results shows high quality factor in the order of thousands for double electrode CMOS SAW resonator compared to single electrode CMOS SAW resonator.
Keywords :
CMOS integrated circuits; UHF integrated circuits; finite element analysis; surface acoustic wave resonators; 2D finite element modeling; CMOS technology; COMSOL Multiphysics; RF CMOS process; SAW resonator; double interdigitated electrode structure; frequency 0.5 GHz to 1 GHz; single interdigitated electrode structure; size 0.18 mum; surface acoustic wave resonator; CMOS integrated circuits; Electrodes; Periodic structures; Resonant frequency; Surface acoustic wave devices; Surface acoustic waves; CMOS; SAW resonator; double IDT; quality factor; resonance frequency; single IDT;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro and Nanoelectronics (RSM), 2013 IEEE Regional Symposium on
Conference_Location :
Langkawi
Print_ISBN :
978-1-4799-1181-3
Type :
conf
DOI :
10.1109/RSM.2013.6706458
Filename :
6706458
Link To Document :
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