مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

671276

Title :

Agenda of conference

fYear :

2013

fDate :

22-25 Oct. 2013

Firstpage :

Lastpage :

Abstract :

Provides a schedule of conference events and a listing of which papers were presented in each session.

Keywords :

Computational modeling; Data models; Integrated circuits; Packaging; Solid modeling; Substrates;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International

Conference_Location :

Taipei, Taiwan

ISSN :

2150-5934

Type :

conf

DOI :

10.1109/IMPACT.2013.6706611

Filename :

6706611

Link To Document :