• DocumentCode
    671288
  • Title

    Remotely-controlled tensile test of copper-cored lead-free solder joint in liquid using permanent magnet

  • Author

    Tada, N. ; Masago, Hiroyasu

  • Author_Institution
    Grad. Sch. of Natural Sci. & Technol., Okayama Univ., Okayama, Japan
  • fYear
    2013
  • fDate
    22-25 Oct. 2013
  • Firstpage
    186
  • Lastpage
    189
  • Abstract
    Solder balls are used for electric connections in various electric devices. Since the electric devices have been widely used for automobiles, airplanes, electric home appliances, personal digital assistances besides conventional computers, their reliability under various conditions including humid and corrosive environments has to be evaluated. The authors proposed a non-contact tensile test method using permanent magnet and applied it to the solder joint testings. As the tensile force is remotely given to the solder joint, it becomes possible to isolate solder joint from gripping jig and set the joint in a liquid container. In this paper, tensile tests of copper-cored lead-free solder joint are carried out both in air and in water conditions, and the results on joint strength are discussed.
  • Keywords
    copper; permanent magnets; solders; tensile testing; Cu; copper cored lead free solder joint; electric connections; electric devices; gripping jig; joint strength; liquid container; noncontact tensile test method; permanent magnet; remotely controlled tensile test; solder balls; solder joint testings; tensile force; Fixtures; Lead; Magnetic forces; Nickel; Reliability; Soldering; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2013.6706624
  • Filename
    6706624