DocumentCode :
671288
Title :
Remotely-controlled tensile test of copper-cored lead-free solder joint in liquid using permanent magnet
Author :
Tada, N. ; Masago, Hiroyasu
Author_Institution :
Grad. Sch. of Natural Sci. & Technol., Okayama Univ., Okayama, Japan
fYear :
2013
fDate :
22-25 Oct. 2013
Firstpage :
186
Lastpage :
189
Abstract :
Solder balls are used for electric connections in various electric devices. Since the electric devices have been widely used for automobiles, airplanes, electric home appliances, personal digital assistances besides conventional computers, their reliability under various conditions including humid and corrosive environments has to be evaluated. The authors proposed a non-contact tensile test method using permanent magnet and applied it to the solder joint testings. As the tensile force is remotely given to the solder joint, it becomes possible to isolate solder joint from gripping jig and set the joint in a liquid container. In this paper, tensile tests of copper-cored lead-free solder joint are carried out both in air and in water conditions, and the results on joint strength are discussed.
Keywords :
copper; permanent magnets; solders; tensile testing; Cu; copper cored lead free solder joint; electric connections; electric devices; gripping jig; joint strength; liquid container; noncontact tensile test method; permanent magnet; remotely controlled tensile test; solder balls; solder joint testings; tensile force; Fixtures; Lead; Magnetic forces; Nickel; Reliability; Soldering; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International
Conference_Location :
Taipei
ISSN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2013.6706624
Filename :
6706624
Link To Document :
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