Title :
Fatigue strength around through hole in printed circuit board
Author :
Kinoshita, T. ; Iwade, Shuhei ; Shima, Shohei ; Kawakami, Tomoya ; Mizushina, Hideki ; Iinaga, Hiroshi
Author_Institution :
Toyama Prefectural Univ., Toyama, Japan
Abstract :
In this study, concavo-convex shape which could not be expected in process of product design was model for through hole in PCB. Elastic-plastic thermal stress simulation was performed to discuss on fatigue strength around through hole in PCB by using a large scale simulator ADVENTURECluster (ver. 4. 8), which was based on finite element method (FEM).
Keywords :
fatigue; finite element analysis; printed circuit design; thermal stresses; ADVENTURECluster; PCB; concavo-convex shape; elastic-plastic thermal stress; fatigue strength; finite element method; large scale simulator; printed circuit board; product design; through hole; Copper; Fatigue; Plastics; Shape; Strain; Stress; Thermal stresses;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International
Conference_Location :
Taipei
DOI :
10.1109/IMPACT.2013.6706630
