Implement of a silicon-based LED packaging module with temperature sensor

This study proposed a novel silicon-based LED packaging module with an integrated temperature sensor. The LED die is mounted directly to a silicon substrate with a resistive nickel/titanium temperature sensor, which can real-timely monitor the temperature variations of the LED inside the package. The thermal conductivity characteristics and sensor performance of specified packaging modules have been evaluated in this study by experimental implementation. The typical experiment result shows that when the thickness of the Ni sensing film and its equivalent length, within a sensing area of 1.4×1.4 mm², are 0.2μm and 23.3mm, respectively. High sensitivity measurement of 3.14Ω/°C was obtained and good linear output was achieved, under the working temperature of LED below 120 °C. A miniaturized, integrated, low-cost smart LED packaging module can be implemented by this co-packaging method and using an auto-control system with high heat dissipation efficiency.