A high reliability, stress-free copper deposit for FPC, polyimide and rigid-flex

Metallizing Smooth Surfaces: Today´s wide variety of laminate materials and specialized dielectric choices pose a challenge for process engineering. In particular, smooth surfaces, such as polyimide, flex circuit substrates and rigid-flex constructions with window cut-outs, can be a challenge for electroless copper and plating processes. Conventional electroless copper systems often required pretreatments with hazardous chemicals or have a small process window to achieve a uniform coverage without blistering.