مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

671367

Title :

Pre announcement

fYear :

2013

fDate :

22-25 Oct. 2013

Firstpage :

Lastpage :

Abstract :

Provides a schedule of conference events and a listing of which papers were presented in each session.

Keywords :

Assembly; Materials; Packaging;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International

Conference_Location :

Taipei

ISSN :

2150-5934

Type :

conf

DOI :

10.1109/IMPACT.2013.6706703

Filename :

6706703

Link To Document :