• DocumentCode
    672580
  • Title

    Improving spatial resolution for EIT reconstructed images through measurement strategies

  • Author

    Chin, Renee Ka Yin ; York, Trevor A.

  • Author_Institution
    Sch. of Eng. & Inf. Technol., Univ. Malaysia Sabah, Kota Kinabalu, Malaysia
  • fYear
    2013
  • fDate
    8-10 Oct. 2013
  • Firstpage
    5
  • Lastpage
    10
  • Abstract
    Reconstructed images produced using Electrical Impedance Tomography (EIT) are notorious for their poor spatial resolution. This is largely due to the ill-posed nature of the EIT problem. Much effort has been made in order to improve on spatial resolution of reconstructed images. One of the more direct approaches is by improving the amount of information obtainable. With the development and transition from 2D to 3D tomography, more measurements can be obtained to better inform the inversion problem through expanding the number of electrodes or through measurement strategies. This paper delves into the latter method, providing a comparison study using sensitivity analysis, stability of measurement analysis and spatial resolution analysis, with the aim of providing a better understanding of the influence of varying different parameters on the quality of reconstructed images, before more unconventional methods of increasing information through unconventional measurement strategies are devised.
  • Keywords
    electric impedance imaging; image reconstruction; image resolution; medical image processing; sensitivity analysis; 2D tomography; 3D tomography; EIT reconstructed images; ElT problem; electrical impedance tomography; inversion problem; measurement stability analysis; reconstructed image quality; sensitivity analysis; spatial resolution analysis; spatial resolution improvement; Atmospheric measurements; Educational institutions; Electrodes; Image reconstruction; Mathematical model; Monitoring; Particle measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal and Image Processing Applications (ICSIPA), 2013 IEEE International Conference on
  • Conference_Location
    Melaka
  • Print_ISBN
    978-1-4799-0267-5
  • Type

    conf

  • DOI
    10.1109/ICSIPA.2013.6707968
  • Filename
    6707968