Title :
Modeling Rotary-Screw-Driven Dispensing Systems for Electronics Packaging
Author :
Shu Zhen Liu ; Jing Yang Peng ; Yu Bao Zhang ; Xiong Biao Chen
Author_Institution :
Inst. of Mech. Eng., Ningbo Univ. of Technol., Ningbo, China
Abstract :
Fluid dispensing is a process of delivering fluid materials in a controllable manner and has found extensive applications in electronics packaging manufacturing. Among various dispensing approaches, the rotary-screw-driven dispensing method has high versatility for dispensing a wide range of fluid materials. Given the fact that the flow rate of material dispensed has significant effects on the quality of electronics packaging, knowledge of the flow rate in rotary screw dispensing systems through mathematical models is desired. This paper presents the development of an integrated dynamic flow-rate model for rotary-screw-driven dispensing systems. The model is composed of two interconnected submodels, one model for the dynamics of the screw-driving system and the other for the flow-rate dynamics in the screw channel. Without loss of generality, a phenomenological model in the form of a linear state space model is adopted for the dynamics of the screw-driving system, and by considering the fluid compressibility, the flow-rate dynamics in the screw channel is represented. Dispensing experiments were performed for model parameter estimation and then for model verification. The results illustrate that the model developed can be used to predict the flow rate in the rotary-screw-driven dispensing systems.
Keywords :
electronics packaging; fluid dynamics; integrated circuit manufacture; parameter estimation; state-space methods; electronics packaging manufacturing; flow-rate dynamics; fluid compressibility; fluid dispensing process; fluid materials; integrated dynamic flow-rate model; interconnected submodels; linear state space model; mathematical models; model parameter estimation; model verification; phenomenological model; rotary-screw-driven dispensing system modelling; screw channel; Angular velocity; Electronics packaging; Fasteners; Materials; Mathematical model; Needles; Predictive models; Dynamic response; fluid flow; modeling; modeling.;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2014.2325894