Title :
Stepped notch antenna array used as a low thermal resistance heat sink
Author :
Duffy, Sean M. ; Brigham, Glenn A. ; Newman, Kevin B. ; Herd, Jeffrey S.
Author_Institution :
MIT Lincoln Lab., Lexington, MA, USA
Abstract :
A stepped notch antenna at Ku-band is developed to provide a thermal heat sink for active arrays. The antenna with forced air cooling provides up to 0.4 °C/W of thermal resistance. The antenna integration with a printed circuit board allows for high volume surface mount assembly of active devices.
Keywords :
heat sinks; microstrip antenna arrays; printed circuits; surface mount technology; thermal resistance; Ku-band; active arrays; forced air cooling; high volume surface mount assembly; low thermal resistance heat sink; printed circuit board; stepped notch antenna array; Antenna arrays; Arrays; Cooling; Resistance heating; Thermal resistance;
Conference_Titel :
Antennas and Propagation Society International Symposium (APSURSI), 2013 IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4673-5315-1
DOI :
10.1109/APS.2013.6710971
