DocumentCode :
673765
Title :
Efficient Nyström solutions for electromagnetic scattering by thin conducting structures
Author :
Xu, Zongben ; Wang, Z.S. ; Chen, X.Z. ; Du, J.L. ; Tong, Mei Song
Author_Institution :
Dept. of Electron. Sci. & Technol., Tongji Univ., Shanghai, China
fYear :
2013
fDate :
7-13 July 2013
Firstpage :
1536
Lastpage :
1537
Abstract :
In the integral equation method for solving electromagnetic problems with thin conducting structures, there are several unfavorable factors. The individual electric field integral equation (EFIE) and magnetic field integral equation (MFIE) may deteriorate the conditioning of matrix equations due to their degeneration when the thickness reduces. Also, there are more near-interaction evaluations in filling the impedance matrix because the near-interactions between observation points and source patches are popular. In addition, many triangular meshes could have a high aspect ratio due to the small thickness and this will present a difficulty for the accurate evaluation of self- and near-interaction elements. Aiming at these factors, we develop an efficient Nyström method to solve the EM problems based on the combined field integral equation (CFIE) and a numerical example is presented to demonstrate its robustness.
Keywords :
electric field integral equations; electromagnetic wave scattering; impedance matrix; EFIE; MFIE; Nystrom solutions; combined field integral equation; electric field integral equation; electromagnetic problems; electromagnetic scattering; impedance matrix; magnetic field integral equation; matrix equations; thin conducting structures; triangular meshes; Equations; Green´s function methods; Impedance; Integral equations; Method of moments; Scattering; Surface impedance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation Society International Symposium (APSURSI), 2013 IEEE
Conference_Location :
Orlando, FL
ISSN :
1522-3965
Print_ISBN :
978-1-4673-5315-1
Type :
conf
DOI :
10.1109/APS.2013.6711427
Filename :
6711427
Link To Document :
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