DocumentCode :
67499
Title :
Novel Approach Toward Plasma Enhancement in Trench-Insulated Gate Bipolar Transistors
Author :
Antoniou, M. ; Lophitis, N. ; Bauer, F. ; Nistor, I. ; Bellini, M. ; Rahimo, M. ; Amaratunga, G. ; Udrea, F.
Author_Institution :
Dept. of Electr. Eng., Univ. of Cambridge, Cambridge, UK
Volume :
36
Issue :
8
fYear :
2015
fDate :
Aug. 2015
Firstpage :
823
Lastpage :
825
Abstract :
In this letter, a trench-insulated gate bipolar transistor (IGBT) design with local charge compensating layers featured at the cathode of the device is presented and analyzed. The superjunction or reduced surface effect proves to be very effective in overcoming the inherited ON-state versus breakdown tradeoff appearing in conventional devices, such as the soft punch through plus or field stop plus (FS+) IGBTs. This design enhances the ON-state performance of the FS+IGBT by increasing the plasma concentration at the cathode side without affecting either the switching performance or the breakdown rating.
Keywords :
insulated gate bipolar transistors; plasma applications; power MOSFET; power bipolar transistors; semiconductor device breakdown; breakdown rating; cathode; local charge compensating layers; plasma enhancement; superjunction power MOSFET; trench-IGBT; trench-insulated gate bipolar transistors; Cathodes; Doping; Electric breakdown; Insulated gate bipolar transistors; Logic gates; Performance evaluation; Switches; Insulated Gate Bipolar Transistor (IGBT); Insulated gate bipolar transistor (IGBT); superjunction power MOSFET; technology trade-off;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2015.2433894
Filename :
7109132
Link To Document :
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