Title :
Novel 3D die-stacked opto-electronic transceiver ICs that allow for waferscale fabrication
Author :
Pinxiang Duan ; Raz, Oded ; Dorren, H.J.S.
Author_Institution :
COBRA Res. Sch., Eindhoven Univ. of Technol., Eindhoven, Netherlands
Abstract :
Optical interconnects can offer small footprint, high bandwidth density and high data rates. In this paper we demonstrate a wafer scale fabrication process of the 3D stacked transceivers which leads to very high bandwidth density as well as potential low cost. Uniform open eye patterns at 10 Gb/s/channel of both 3D stacked transmitter and receiver ICs indicates that the interconnection technology suggested is robust.
Keywords :
integrated optoelectronics; optical fabrication; optical interconnections; optical transceivers; 3D die-stacked optoelectronic transceiver IC; 3D stacked receiver IC; 3D stacked transmitter IC; bandwidth density; bit rate 10 Gbit/s; data rate; interconnection technology; optical interconnects; uniform open eye pattern; wafer scale fabrication; CMOS integrated circuits; Optical interconnections; Optical transmitters; Receivers; Stacking; Three-dimensional displays;
Conference_Titel :
Microoptics Conference (MOC), 2013 18th
Conference_Location :
Tokyo
