DocumentCode
675244
Title
Temperature stabilization of high-power led chips using low-cost passive heat sinks
Author
Balvis, Eduardo ; Bendana, Ricardo ; Michinel, Humberto ; Fernandez de Cordoba, Pedro
Author_Institution
Innebo, Spain
fYear
2013
fDate
27-30 Oct. 2013
Firstpage
1
Lastpage
2
Abstract
We present a numerical analysis and experimental measurements of the temperature stabilization of high-power LED chips that we have obtained by employing an aluminium passive heat sink, designed to be used in a compact light bulb configuration. We demonstrate that our system keeps the temperature of the LED chip well-below 60°C yielding long-term operation of the device. Our simulations have been performed for a device of low fabrication costs and which enables an easy installation in public streetlights. The experimental measurements performed in different configurations show a nice agreement with the numerical calculations.
Keywords
aluminium; heat sinks; light emitting diodes; numerical analysis; optical design techniques; optical fabrication; Al; compact light bulb configuration; high-power LED chips; low-cost aluminium passive heat sinks; numerical analysis; optical design; optical fabrication; public streetlights; temperature stabilization; Heat sinks; Heating; Light emitting diodes; Numerical models; Steady-state; Temperature distribution; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Microoptics Conference (MOC), 2013 18th
Conference_Location
Tokyo
Type
conf
Filename
6715141
Link To Document