• DocumentCode
    675244
  • Title

    Temperature stabilization of high-power led chips using low-cost passive heat sinks

  • Author

    Balvis, Eduardo ; Bendana, Ricardo ; Michinel, Humberto ; Fernandez de Cordoba, Pedro

  • Author_Institution
    Innebo, Spain
  • fYear
    2013
  • fDate
    27-30 Oct. 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We present a numerical analysis and experimental measurements of the temperature stabilization of high-power LED chips that we have obtained by employing an aluminium passive heat sink, designed to be used in a compact light bulb configuration. We demonstrate that our system keeps the temperature of the LED chip well-below 60°C yielding long-term operation of the device. Our simulations have been performed for a device of low fabrication costs and which enables an easy installation in public streetlights. The experimental measurements performed in different configurations show a nice agreement with the numerical calculations.
  • Keywords
    aluminium; heat sinks; light emitting diodes; numerical analysis; optical design techniques; optical fabrication; Al; compact light bulb configuration; high-power LED chips; low-cost aluminium passive heat sinks; numerical analysis; optical design; optical fabrication; public streetlights; temperature stabilization; Heat sinks; Heating; Light emitting diodes; Numerical models; Steady-state; Temperature distribution; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microoptics Conference (MOC), 2013 18th
  • Conference_Location
    Tokyo
  • Type

    conf

  • Filename
    6715141