Title :
Fin width scaling for improved short channel control and performance in aggressively scaled channel length SOI finFETs
Author :
Paul, A. ; Chun-Chen Yeh ; Standaert, T. ; Johnson, J.B. ; Bryant, A. ; Tripathi, N. ; Tsutsui, G. ; Yamashita, Takayoshi ; Basker, Veeraraghvan S. ; Faltermeier, J. ; Jin Cho ; Huiming Bu ; Khare, Manish
Author_Institution :
Technol. Res., GLOBALFOUNDRIES Inc., Albany, NY, USA
Abstract :
This work presents SOI finFETs with fin width (Dfin) scaled to sub 15nm. The process flow provides robust Dfin scaling as depicted by the universal electrostatic scaling of the DIBL and sub-threshold swing (SS). The high field long channel mobility drops by ~6% with Dfin scaling, however, DIBL and SS improves by ~1.5X and ~2X, respectively, for 20nm channel length n/pfinFETs. The effective current (Ieff) at fixed Ioff improves by ~20% and ~30% for p and n finFETs, respectively, with Dfin scaling.
Keywords :
MOSFET; semiconductor device manufacture; silicon-on-insulator; DIBL; aggressively scaled channel length SOI finFET; drain induced barrier lowering; long channel mobility; process flow provides; robust fin width scaling; short channel control; silicon-on-insulator; subthreshold swing; universal electrostatic scaling; Electrostatics; FinFETs; Logic gates; Market research; Performance evaluation; Process control; Robustness;
Conference_Titel :
SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2013 IEEE
Conference_Location :
Monterey, CA
DOI :
10.1109/S3S.2013.6716521