DocumentCode
675575
Title
Foundry SOI technology for wireless front end modules
Author
Hurwitz, P. ; Chaudry, S. ; Blaschke, V. ; Racanelli, M.
Author_Institution
TowerJazz, Newport Beach, CA, USA
fYear
2013
fDate
7-10 Oct. 2013
Firstpage
1
Lastpage
4
Abstract
In the last few years, RF SOI has become the technology of choice for RF switches (RFSW) in wireless front-end modules, displacing GaAs pHEMT. More recently RF SOI has also been deployed to switch capacitor banks in antenna tuning applications and is now being discussed as the right technology for integration of tunable power-amplifiers, promising a path to a single-chip front-end module. In this paper we review the latest advancements in RF SOI foundry technology with focus on key figures of merit such as Ron × Coff, switch branch power handling, and linearity. In addition to these process-driven metrics, we will describe attributes of the compact models and design environment that allow fast and accurate simulation of small signal and large signal RFSW performance to create the most advanced and highly integrated products.
Keywords
microwave switches; silicon-on-insulator; RF SOI foundry technology; RF switches; Ron x Coff; Si; linearity; switch branch power handling; wireless front end modules; Antennas; Capacitance; Foundries; Impedance; Linearity; Radio frequency; Wireless communication; RF switch; SOI; front end modules;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2013 IEEE
Conference_Location
Monterey, CA
Type
conf
DOI
10.1109/S3S.2013.6716535
Filename
6716535
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