DocumentCode :
675757
Title :
A Green Context-Aware Platform for Smart Living
Author :
Chun-Yu Chen ; Yu-Jen Ku ; Chih-Wei Ho ; Yan-Ze Lin ; Chung-Ting Chou
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear :
2013
fDate :
16-18 Dec. 2013
Firstpage :
275
Lastpage :
281
Abstract :
Smart living has always been considered as a killer application when new technologies emerged. It is envisioned that smart living will enable a healthier, safer and more comfortable life while reducing resource consumption. Unfortunately, adoption of smart-living technologies and services has been very slow especially in residential environments. Several factors have contributed to such slow and limited deployment. First, installation and configuration of a smart system is usually complicated. Second, maintenance is always a headache for ordinary users. Any repair that requires rewiring is not only time consuming but also very costly. Finally, access to smart-living information and services was not properly addressed. In views of these challenges, a green and context-aware platform is proposed for smart living. In this platform, a full range of self-powered behavioral sensors are developed. These sensors connect objects including toilets, doors, windows, gas stoves, faucets and even tooth brushes to a home network so that various user/environment activities can be recorded. The platform, with the the help of our sensors, is able to provide customized, context-aware services without using any intrusive sensors such as cameras. The platform is implemented in an off-campus apartment to demonstrate its potentials.
Keywords :
green computing; ubiquitous computing; green context-aware platform; off-campus apartment; residential environments; self-powered behavioral sensors; smart-living technologies; IEEE 802.11 Standards; Intelligent sensors; Logic gates; Magnetic sensors; Mechanical sensors; Servers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Service-Oriented Computing and Applications (SOCA), 2013 IEEE 6th International Conference on
Conference_Location :
Koloa, HI
Print_ISBN :
978-1-4799-2701-2
Type :
conf
DOI :
10.1109/SOCA.2013.22
Filename :
6717318
Link To Document :
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