DocumentCode :
675956
Title :
A D-band packaged antenna on low temperature co-fired ceramics for wire-bond connection with an indium phosphide power meter
Author :
Bing Zhang ; Li Wei ; Zirath, Herbert
Author_Institution :
Dept. of Microtechnol. & Nanosci. MC2, Chalmers Univ. of Technol., Gothenburg, Sweden
Volume :
01
fYear :
2013
fDate :
23-25 Oct. 2013
Firstpage :
637
Lastpage :
640
Abstract :
A D-band packaged grid array antenna (GAA) on Ferro A6M low temperature co-fired ceramic (LTCC, εr = 5.74, tanδ = 0.0023 @ 145 GHz) is presented. It is designed for wire-bond connection with an indium phosphide (InP) power meter as a demonstration of a D-band packaged radio. Dimensions of the GAA (x, y, z) = (12, 12, 0.5) mm3. Simulated by Ansoft HFSS, the antenna´s impedance bandwidth is 139 - 149.3 GHz, maximum gain of 20.9 dBi @ 147.8 GHz with 3-dB gain bandwidth 139.5 - 150.8 GHz, vertical beams of 10° beamwidth in the broadside are detected 139 - 151 GHz on both E- and H-planes. The 25 um diameter co-planar bonding wires that bridge the InP chip and LTCC antenna substrate over a 250 um separation are studied, showing acceptable insertion loss and limited bandwidth.
Keywords :
III-V semiconductors; antenna arrays; ceramic packaging; indium compounds; power meters; Ansoft HFSS; D-band packaged grid array antenna; InP; antenna impedance bandwidth; co-planar bonding wires; frequency 139 GHz to 149.3 GHz; frequency 145 GHz; indium phosphide power meter; low temperature co-fired ceramics; wire-bond connection; Antennas; Arrays; Bandwidth; Bonding; Indium phosphide; Substrates; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas & Propagation (ISAP), 2013 Proceedings of the International Symposium on
Conference_Location :
Nanjing
Print_ISBN :
978-7-5641-4279-7
Type :
conf
Filename :
6717540
Link To Document :
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