Title :
Transmission characteristics of via holes in high-speed PCB
Author :
He Xiangyang ; Lei Zhenya ; Wang Qing
Author_Institution :
Sch. of Electron. Eng., Xidian Univ., Xi´an, China
Abstract :
A method of analyzing transmission characteristics of via holes in the time domain is presented in this paper. A suitable analysis model is set up using CST (Computer Simulation Technology). With theoretical analysis, the effect of via structures on signal transmission characteristics could be acquired. The simulation results show that appropriate design for via holes can reduce transmission characteristics issues effectively.
Keywords :
printed circuits; time-domain analysis; transmission lines; CST; computer simulation technology; high-speed PCB; holes; signal transmission characteristics; time domain; Apertures; Delay effects; Impedance; Inductance; Parasitic capacitance; Reflection; Substrates;
Conference_Titel :
Antennas & Propagation (ISAP), 2013 Proceedings of the International Symposium on
Conference_Location :
Nanjing
Print_ISBN :
978-7-5641-4279-7
