• DocumentCode
    676401
  • Title

    A new way to break through the limitation of CS-layer doping on the breakdown voltage of CSTBT: The superjunction solution

  • Author

    Zhigui Li ; Jiang, Frank X. C. ; Binghua Li ; Xinnan Lin

  • Author_Institution
    Shenzhen Grad. Sch., Key Lab. of Integrated Microsyst., Peking Univ., Shenzhen, China
  • fYear
    2013
  • fDate
    22-25 Oct. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A novel high performance carrier stored trench transistor (CSTBT) with a superjunction structure (SJ-CSTBT) proposed. It breaks through the limitation of carrier stored (CS) layer on the IGBT breakdown voltage Without CS-layer doping concentration limitation, the proposed SJ-CSTBT has better performances on both Vce(sat) and breakdown voltage (BV) than the conventional CSTBT(C-CSTBT). While the p-pillars collect the plasma deep from the anode side, thus its turn-off speed is significantly enhanced and turn-off loss (Eoff) is reduced. The static and dynamic performances are simulated by 2D numerical simulation. The simulation results show that the SJ-CSTBT exhibits a breakdown voltage that is raised by 400 V, and the on-state voltage is reduced by 0.4 V. At the same time, the turn-off loss is decreased by about 50%. Even when the CS-layer doping is above 4e16 cm-3, the BV of the proposed device structure is higher than 1500V while the C-CSTBT is lower than 200V.
  • Keywords
    insulated gate bipolar transistors; semiconductor device breakdown; semiconductor doping; CS layer doping; CSTBT; IGBT breakdown voltage; doping concentration limitation; high performance carrier stored trench transistor; superjunction solution; superjunction structure; voltage 400 V; Anodes; Breakdown voltage; Doping; Electric fields; Insulated gate bipolar transistors; Junctions; Performance evaluation; CS-layer; CSTBT; SJ-CSTBT; high breakdown voltage; superjunction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2013 - 2013 IEEE Region 10 Conference (31194)
  • Conference_Location
    Xi´an
  • ISSN
    2159-3442
  • Print_ISBN
    978-1-4799-2825-5
  • Type

    conf

  • DOI
    10.1109/TENCON.2013.6718458
  • Filename
    6718458