Title :
Parallel Thermal Analysis of 3-D Integrated Circuits With Liquid Cooling on CPU-GPU Platforms
Author :
Xue-Xin Liu ; Kuangya Zhai ; Zao Liu ; Kai He ; Tan, Sheldon X.-D ; Wenjian Yu
Author_Institution :
Dept. of Electr. Eng., Univ. of California at Riverside, Riverside, CA, USA
Abstract :
In this brief, we propose an efficient parallel finite difference-based thermal simulation algorithm for 3-D-integrated circuits (ICs) using generalized minimum residual method (GMRES) solver on CPU-graphic processing unit (GPU) platforms. First, the new method starts from basic physics-based heat equations to model 3-D-ICs with intertier liquid cooling microchannels and directly solves the resulting partial differential equations. Second, we develop a new parallel GPU-GMRES solver to compute the resulting thermal systems on a CPU-GPU platform. We also explore different preconditioners (implicit and explicit) and study their performances on thermal circuits and other types of matrices. Experimental results show the proposed GPU-GMRES solver can deliver orders of magnitudes speedup over the parallel LU-based solver and up to 4× speedup over CPU-GMRES for both dc and transient thermal analyzes on a number of thermal circuits and other published problems.
Keywords :
finite difference methods; graphics processing units; partial differential equations; thermal analysis; three-dimensional integrated circuits; 3D-integrated circuits; CPU-GPU platforms; CPU-graphic processing unit platforms; generalized minimum residual method; intertier liquid cooling microchannels; parallel GPU-GMRES solver; parallel finite difference-based thermal simulation algorithm; partial differential equations; physics-based heat equations; Graphics processing units; Heating; Integrated circuit modeling; Liquid cooling; Mathematical model; Thermal analysis; Vectors; 3-D-integrated circuit (IC); finite difference; generalized minimum residual method (GMRES); graphic processing unit (GPU) parallel computing; thermal analysis; thermal analysis.;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2014.2309617