DocumentCode :
678190
Title :
Sponsors
fYear :
2013
fDate :
12-15 Dec. 2013
Firstpage :
1
Lastpage :
2
Abstract :
The conference organizers greatly appreciate the support of the various corporate sponsors listed.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
Conference_Location :
Nara, Japan
Print_ISBN :
978-1-4799-2313-7
Type :
conf
DOI :
10.1109/EDAPS.2013.6724387
Filename :
6724387
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=678190
