Title :
Performance comparison between air-gap based coaxial TSV and conventional circular TSV in 3D-ICs
Abstract :
In this paper, performance comparison between Air-Gap Based Coaxial TSV and conventional circular TSV are presented. The comparison shows that the air-gap TSVs reduce the overall parasitic capacitance and the overall energy loss compared to the conventional circular TSV or conventional coaxial TSV.
Keywords :
air gaps; three-dimensional integrated circuits; 3DIC; air gap based coaxial TSV; conventional circular TSV; conventional coaxial TSV; energy loss; parasitic capacitance; Air gaps; Through-silicon vias; Air-Gap; Coaxial; TSV; Three-Dimensional ICs; Through Silicon Via;
Conference_Titel :
Design and Test Symposium (IDT), 2013 8th International
Conference_Location :
Marrakesh
DOI :
10.1109/IDT.2013.6727102
