• DocumentCode
    67932
  • Title

    A Wideband and Compact EBG Structure With a Circular Defected Ground Structure

  • Author

    Myunghoi Kim ; Dong Gun Kam

  • Author_Institution
    Electron. & Telecommun. Res. Inst., Daejeon, South Korea
  • Volume
    4
  • Issue
    3
  • fYear
    2014
  • fDate
    Mar-14
  • Firstpage
    496
  • Lastpage
    503
  • Abstract
    We propose a new analysis method to determine the bandgap characteristics of an electromagnetic bandgap structure with a defected ground structure (DGS). The proposed method is based on a 1-D segmented transmission line model and a piecewise linear approximation of Zo within a unit cell. Although the previous method is only applicable to rectangular DGSs (RDGSs), the proposed method is applicable to any DGS shapes. As an example, the proposed method is applied to a circular DGS and shows a good agreement with full-wave simulations of the unit cell and measurements of 11 × 11 unit cells. The circular DGS achieves a 15% improvement in the stopband bandwidth over the RDGS with the same perforation area. The proposed method allows us to explore a variety of DGS shapes in the search for better stopband characteristics. It also offers the basis for numerical optimization techniques to be used in synthesizing DGS shapes to meet required stopband characteristics.
  • Keywords
    defected ground structures; numerical analysis; optimisation; photonic band gap; piecewise linear techniques; transmission line theory; 1D segmented transmission line model; RDGSs; circular DGS; circular defected ground structure; compact EBG structure; electromagnetic bandgap structure characteristics; full-wave simulations; numerical optimization techniques; piecewise linear approximation; rectangular DGSs; stopband characteristics; unit cell; wideband EBG structure; Bandwidth; Dispersion; Mathematical model; Metamaterials; Photonic band gap; TV; Circular defected ground structure (CDGS); DGS; dispersion analysis; electromagnetic bandgap (EBG); power/ground (P/G) noise; size reduction; stopband enhancement;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2285407
  • Filename
    6648419