Title :
Land classification from LiDAR full-waveforms based on multi-class support vector machines
Author :
Xiaolu Li ; Lian Ma ; Lijun Xu
Author_Institution :
Sch. of Instrum. Sci. & Opto-Electron. Eng., Beihang Univ., Beijing, China
Abstract :
In this study, a multi-class support vector machines (SVM) based land classification method is presented to predict the land types of Beijing area. The returned full-waveforms were collected from the Ice, Cloud and land Elevation Satellite (ICESat) mission and the Full Width at Half Maximum (FWHM) of the full-waveforms were used to be the attributes of test data for generating the SVM prediction model. FWHM were obtained from waveforms filtered by Empirical Mode Decomposition (EMD). The SVM prediction model with high cross validation accuracy was selected to predict the land types of Beijing area. GLAS full-waveforms, which were used to predict and validate the land classification, were acquired when ICESat was passing over Beijing urban and rural areas from 1st Jan 2003 to 31st Dec 2005. Besides of terrace and building, the main land types of Beijing area are plain and stone Mountain that lacks of trees. Thus the received waveforms of ICESat/GLAS were divided into five kinds, `invalid´, `plain´, `terrace´, `building´ and `mountain´ waveforms. Over this test site, the algorithm achieved an overall classification accuracy of 91.5%. This method can be developed to be an on-line automation algorithm to classify the land type.
Keywords :
artificial satellites; geophysics computing; optical radar; remote sensing; support vector machines; Beijing area; EMD; GLAS full-waveforms; ICESat mission; LiDAR full-waveforms; SVM; empirical mode decomposition; ice, cloud and land elevation satellite mission; land classification; multiclass support vector machines; Accuracy; Buildings; Cities and towns; Filtering; Laser radar; Lasers; Support vector machines; Full-waveform; ICESat/GLAS; Land classification; LiDAR; Support vector machines;
Conference_Titel :
Imaging Systems and Techniques (IST), 2013 IEEE International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4673-5790-6
DOI :
10.1109/IST.2013.6729651