• DocumentCode
    679737
  • Title

    Design, analysis, and modelling of a MEMS capacitive microphone for integration into CMOS circuits

  • Author

    Ahmadnejad, Javad ; Ganji, Bahram Azizollah ; Nemati, Ali

  • Author_Institution
    Electr. & Comput. Eng. Dept., Babol Noshirvani Univ. of Technol., Babol, Iran
  • fYear
    2013
  • fDate
    19-21 Dec. 2013
  • Firstpage
    186
  • Lastpage
    190
  • Abstract
    A MEMS capacitive microphone with high mechanical sensitivity is presented. The microphone has a diaphragm thickness of 1 μm, 0.5 × 0.5 mm2 dimension, and an air gap of 1.0 μm. Using the results from analysis and simulation, important features of MEMS capacitive microphone such as pull-in voltage, sensitivity and resonance frequency are respectively obtained as 3.8v, -43dbv/Pa, and 74 kHz. A model for this MEMS capacitive microphone is provided by using the relationship between capacitance of microphone and exerted pressure of acoustic wave. To study the accuracy of model, it is simulated in an RC circuit. The results from the simulations show that the proposed model has similar functions as a variable capacitor structure. Simulations show that voltage signal in steady state operates according to exerted pressure and has swing around the bias point of microphone (2.3 V).
  • Keywords
    CMOS integrated circuits; capacitive sensors; micromechanical devices; microphones; CMOS circuits; MEMS capacitive microphone; RC circuit; acoustic wave; air gap; frequency 74 kHz; mechanical sensitivity; pull-in voltage; resonance frequency; size 1 mum; variable capacitor structure; voltage 2.3 V; voltage signal; Capacitance; Integrated circuit modeling; Micromechanical devices; Microphones; Resonant frequency; Semiconductor device modeling; Sensitivity; CMOS circuit; Capacitive microphone; Micro electromechanichal system (MEMS); mechanical sensivity; pull-in voltage; resonance frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Electronics (PrimeAsia), 2013 IEEE Asia Pacific Conference on Postgraduate Research in
  • Conference_Location
    Visakhapatnam
  • Print_ISBN
    978-1-4799-2750-0
  • Type

    conf

  • DOI
    10.1109/PrimeAsia.2013.6731202
  • Filename
    6731202