Design of Magnetic Transceivers for 3-D Integrated Circuits

Author

Korenivski, Vladislav

Author_Institution

KTH R. Inst. of Technol., Stockholm, Sweden

Volume

50

Issue

11

fYear

2014

fDate

Nov. 2014

Firstpage

1

Lastpage

4

Abstract

Use of magnetic film inductors as transceiver elements for wireless transfer of power and signal communication between vertically stacked silicon integrated circuits is discussed. Two characteristic designs are compared-a vertical magnetic core with high-aspect-ratio laminations and a planar magnetic core where flux closure is achieved by a suitable design of the interchip air gap. The latter design is argued to hold a promise for 3-D circuit integration.

Keywords

electromagnetic induction; inductive power transmission; laminations; magnetic cores; magnetic thin films; radiofrequency power transmission; three-dimensional integrated circuits; transceivers; 3D Integrated Circuits; characteristic designs; flux closure; high-aspect-ratio laminations; interchip air gap; magnetic film inductors; magnetic transceiver design; planar magnetic core; signal communication; transceiver elements; vertical magnetic core; vertically stacked silicon integrated circuits; wireless power transfer; Inductors; Magnetic circuits; Magnetic cores; Magnetic separation; Perpendicular magnetic anisotropy; Soft magnetic materials; 3-D circuit integration; Integrated circuits (ICs); magnetic film inductors;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/TMAG.2014.2325132

Filename

6971329