Title :
Design of Magnetic Transceivers for 3-D Integrated Circuits
Author :
Korenivski, Vladislav
Author_Institution :
KTH R. Inst. of Technol., Stockholm, Sweden
Abstract :
Use of magnetic film inductors as transceiver elements for wireless transfer of power and signal communication between vertically stacked silicon integrated circuits is discussed. Two characteristic designs are compared-a vertical magnetic core with high-aspect-ratio laminations and a planar magnetic core where flux closure is achieved by a suitable design of the interchip air gap. The latter design is argued to hold a promise for 3-D circuit integration.
Keywords :
electromagnetic induction; inductive power transmission; laminations; magnetic cores; magnetic thin films; radiofrequency power transmission; three-dimensional integrated circuits; transceivers; 3D Integrated Circuits; characteristic designs; flux closure; high-aspect-ratio laminations; interchip air gap; magnetic film inductors; magnetic transceiver design; planar magnetic core; signal communication; transceiver elements; vertical magnetic core; vertically stacked silicon integrated circuits; wireless power transfer; Inductors; Magnetic circuits; Magnetic cores; Magnetic separation; Perpendicular magnetic anisotropy; Soft magnetic materials; 3-D circuit integration; Integrated circuits (ICs); magnetic film inductors;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2014.2325132
