DocumentCode
680621
Title
Emerging reconfigurable systems: Exploring 3D FPGA architectures
Author
Salah, Khaled ; AbdelSalam, Mohamed
Author_Institution
Mentor Graphics, Cairo, Egypt
fYear
2013
fDate
15-18 Dec. 2013
Firstpage
1
Lastpage
4
Abstract
Although FPGAs are a flexible alternative to ASICs, they suffer from interconnection delay which results in comparatively poor performance. Using 3D-FPGA instead of 2D-FPGA reduces the Manhattan distance between the components which results in reduction in interconnect length, delay and hence improved performance and speed. In this paper, we introduce the recent trends in 3D FPGA architectures, discuss the challenges, and display the performance evaluation metrics.
Keywords
field programmable gate arrays; three-dimensional integrated circuits; 3D FPGA architectures; Manhattan distance; delay; interconnect length; reconfigurable systems; Delays; Design automation; Field programmable gate arrays; Routing; Switches; Three-dimensional displays; Through-silicon vias; 3D Integration; FPGA; Through Silicon Via;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics (ICM), 2013 25th International Conference on
Conference_Location
Beirut
Print_ISBN
978-1-4799-3569-7
Type
conf
DOI
10.1109/ICM.2013.6734947
Filename
6734947
Link To Document