• DocumentCode
    680621
  • Title

    Emerging reconfigurable systems: Exploring 3D FPGA architectures

  • Author

    Salah, Khaled ; AbdelSalam, Mohamed

  • Author_Institution
    Mentor Graphics, Cairo, Egypt
  • fYear
    2013
  • fDate
    15-18 Dec. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Although FPGAs are a flexible alternative to ASICs, they suffer from interconnection delay which results in comparatively poor performance. Using 3D-FPGA instead of 2D-FPGA reduces the Manhattan distance between the components which results in reduction in interconnect length, delay and hence improved performance and speed. In this paper, we introduce the recent trends in 3D FPGA architectures, discuss the challenges, and display the performance evaluation metrics.
  • Keywords
    field programmable gate arrays; three-dimensional integrated circuits; 3D FPGA architectures; Manhattan distance; delay; interconnect length; reconfigurable systems; Delays; Design automation; Field programmable gate arrays; Routing; Switches; Three-dimensional displays; Through-silicon vias; 3D Integration; FPGA; Through Silicon Via;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics (ICM), 2013 25th International Conference on
  • Conference_Location
    Beirut
  • Print_ISBN
    978-1-4799-3569-7
  • Type

    conf

  • DOI
    10.1109/ICM.2013.6734947
  • Filename
    6734947