DocumentCode
681398
Title
Abstracted radon profiles for fingerprint recognition
Author
Sandhan, Tushar ; Hyung Jin Chang ; Jin Young Choi
Author_Institution
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul, South Korea
fYear
2013
fDate
15-18 Sept. 2013
Firstpage
4156
Lastpage
4160
Abstract
Conventional minutiae-based fingerprint recognition approaches consider only local characteristics and their accuracy dramatically decreases as the number of available minutiae decreases. We propose new features based on Abstracted Radon Profile (ARP). Proposed method uses global properties of an image and it does not necessitate any heavy preprocessing as in classical methods. By using independent gradual patching via proposed multilayer architecture, local characteristics of an image are also preserved. ARP features have an advantage of being robust to zero mean additive noise. For sparse signal representation, dictionary is constructed from the ARP features of the training samples. Recognition is done by ℓ1-minimization with quadratic constraints, so this framework can handle dense noise by exploiting the fact that these errors are often sparse. Experimental results in assessing recognition performance demonstrate the proposed approach outperforms the conventional approaches in correlation and distance based comparisons. Computational time comparison result shows the proposed feature is more efficient than brute-force method of image alignment and promising for handling other pattern recognition problems as well.
Keywords
fingerprint identification; image representation; pattern recognition; radon; abstracted radon profiles; computational time; dictionary; global properties; heavy preprocessing; independent gradual patching; minutiae-based fingerprint recognition; multilayer architecture; pattern recognition; sparse signal representation; zero mean additive noise; Abstracted Radon Profile; Pattern-matching; fingerprint; sparse representation;
fLanguage
English
Publisher
ieee
Conference_Titel
Image Processing (ICIP), 2013 20th IEEE International Conference on
Conference_Location
Melbourne, VIC
Type
conf
DOI
10.1109/ICIP.2013.6738856
Filename
6738856
Link To Document