DocumentCode :
682508
Title :
Impressum
fYear :
2013
fDate :
24-27 Oct. 2013
Firstpage :
1
Lastpage :
4
Abstract :
Provides general conference information and includes a listing of current committee members and society officers.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2013 IEEE 19th International Symposium for
Conference_Location :
Galati, Romania
Type :
conf
DOI :
10.1109/SIITME.2013.6743635
Filename :
6743635
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=682508