DocumentCode
682518
Title
Thermal modelling of IC packages
Author
Fodor, Alexandra ; Jano, Rajmond
Author_Institution
Appl. Electron. Dept., Tech. Univ. of Cluj Napoca, Cluj-Napoca, Romania
fYear
2013
fDate
24-27 Oct. 2013
Firstpage
149
Lastpage
152
Abstract
The presented work analyses the effect of the IC package on heat dissipation. Thermal simulations of three types of IC packaging have been carried out. DIP-28, TQFP-32 and MLF-32 packaging models have been implemented in SolidWorks 2012 and their efficiency in evacuating heat has been evaluated and compared. Natural cooling was investigated in an open environment and investigations in closed spaces and with forced cooling applied were made. The research focuses on accurately modelling electronic packaging of integrated components.
Keywords
cooling; integrated circuit modelling; integrated circuit packaging; DIP-28; IC packages; MLF-32; SolidWorks 2012; TQFP-32; electronic packaging; heat dissipation; thermal modelling; thermal simulations; Cooling; Electronic packaging thermal management; Electronics packaging; Heating; Integrated circuit modeling; Solid modeling; DIP; MLF; TQFP; model; thermal;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2013 IEEE 19th International Symposium for
Conference_Location
Galati
Type
conf
DOI
10.1109/SIITME.2013.6743662
Filename
6743662
Link To Document