Title :
Thermal modelling of IC packages
Author :
Fodor, Alexandra ; Jano, Rajmond
Author_Institution :
Appl. Electron. Dept., Tech. Univ. of Cluj Napoca, Cluj-Napoca, Romania
Abstract :
The presented work analyses the effect of the IC package on heat dissipation. Thermal simulations of three types of IC packaging have been carried out. DIP-28, TQFP-32 and MLF-32 packaging models have been implemented in SolidWorks 2012 and their efficiency in evacuating heat has been evaluated and compared. Natural cooling was investigated in an open environment and investigations in closed spaces and with forced cooling applied were made. The research focuses on accurately modelling electronic packaging of integrated components.
Keywords :
cooling; integrated circuit modelling; integrated circuit packaging; DIP-28; IC packages; MLF-32; SolidWorks 2012; TQFP-32; electronic packaging; heat dissipation; thermal modelling; thermal simulations; Cooling; Electronic packaging thermal management; Electronics packaging; Heating; Integrated circuit modeling; Solid modeling; DIP; MLF; TQFP; model; thermal;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2013 IEEE 19th International Symposium for
Conference_Location :
Galati
DOI :
10.1109/SIITME.2013.6743662
