Title :
Lead/lead free solder joints comparative electrical tests as function of microstructure and soldering thermal profile
Author :
Branzei, Mihai ; Miculescu, F. ; Bibis, Adrian ; Cristea, Ionut ; Plotog, I. ; Varzaru, Gaudentiu ; Mihailescu, Bogdan
Author_Institution :
Fac. of Mater. Sci. & Eng., Univ. Politeh. of Bucharest, Bucharest, Romania
Abstract :
The solder joints properties are determined by the specific morphology of their microstructure. In the paper are presented the comparative resistance measurements of the solder joints resulted by usage of lead/lead-free solder pastes from Vapor Phase Soldering Processes (VPS) having thermal profile with two different cooling rate, slow one (0.5 K/s) and rapid one (4 K/s). The results will be promote to develop the practical applications of this soldering technology and to contribute at realization of a data base useful for better selection of lead-free solder paste in the design and manufacturing area.
Keywords :
RoHS compliance; crystal microstructure; electric properties; lead alloys; solders; cooling rate; electrical tests; lead free solder joints; leaded solder joints; microstructure profile; soldering technology; soldering thermal profile; vapor phase soldering processes; Cooling; Current measurement; Electrical resistance measurement; Microstructure; Resistance; Soldering; Voltage measurement; Solder joints resistance; VPS cooling rate;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2013 IEEE 19th International Symposium for
Conference_Location :
Galati
DOI :
10.1109/SIITME.2013.6743685
