DocumentCode :
682533
Title :
Lead/Lead Free solder joints comparative shear tests function of working temperature and soldering thermal profile
Author :
Plotog, I. ; Varzaru, Gaudentiu ; Mihailescu, Bogdan ; Branzei, Mihai ; Bibis, Adrian ; Cristea, Ionut
Author_Institution :
Centre for Technol. Electron. & Interconnection Tech., Politeh. Univ. of Bucharest (UPB-CETTI), Bucharest, Romania
fYear :
2013
fDate :
24-27 Oct. 2013
Firstpage :
283
Lastpage :
286
Abstract :
The domains exempted by the RoHS EU Directive, as aerospace, where Sn63Pb37 eutectic solder alloy with low silver content addition are used, are characterized by a large range of working temperatures and high mechanical stress level. In the paper, the mechanical strength of solder joints produced using Lead and Lead-Free solder pastes into Vapor Phase Soldering processes characterized by different cooling rates, were benchmarked by temperature in respect to the concept of "Homologous temperature". The experiments were done by measuring the solder joints shear forces and keeping the surface of test boards at temperatures up to 398.15 K (125°C). The experiments results consist in qualitative/quantitative light microscopy analyses and values of solder joints shear forces. The results offer the possibility to create a data base useful to define a methodology for future qualification of lead-free solder alloys according to the RoHS EU Directive.
Keywords :
RoHS compliance; cooling; eutectic alloys; lead alloys; materials testing; solders; tin alloys; RoHS EU Directive; Sn63Pb37; comparative shear tests function; different cooling rates; eutectic solder alloy; homologous temperature; lead free solder joints; leaded solder joints; mechanical strength; soldering thermal profile; temperature 398.15 K; vapor phase soldering processes; working temperature; Cooling; Lead; Soldering; Temperature; Temperature dependence; Temperature measurement; Solder joints mechanical stress; Vapor Phase Soldering (VPS); homologous temperature (TH);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2013 IEEE 19th International Symposium for
Conference_Location :
Galati
Type :
conf
DOI :
10.1109/SIITME.2013.6743691
Filename :
6743691
Link To Document :
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