• DocumentCode
    682966
  • Title

    Recrystallized silicon thin-film solar cells on zircon ceramics

  • Author

    Schillinger, Kai ; Janz, Siegfried ; Reber, Stefan

  • Author_Institution
    Fraunhofer Inst. for Solar Energy Syst. (ISE), Freiburg, Germany
  • fYear
    2013
  • fDate
    16-21 June 2013
  • Firstpage
    1784
  • Lastpage
    1787
  • Abstract
    This work describes the processing of recrystallized silicon thin-film solar cells and its typical defects. Zircon (ZrSiO4) ceramic substrates of technical grade with potential production costs of <; 20 €/m2 were used. Those substrates were encapsulated in crystalline silicon carbide, deposited by atmospheric pressure chemical vapor deposition (APCVD). The active silicon layers were also formed using APCVD. Zone-melting recrystallization (ZMR) was used to enlarge Si grains. Si films crystallized on SiC show characteristic Σ3 twin grain boundaries parallel to the growth direction. The Si crystals achieve widths up to several mm and lengths of several cm. Solar cells made from such material achieved open circuit voltages up to 566 mV on zircon and up to 600 mV on equally processed mc-Si.
  • Keywords
    ceramics; chemical vapour deposition; elemental semiconductors; silicon compounds; solar cells; thin film devices; twin boundaries; zirconium compounds; zone melting recrystallisation; APCVD; SiC; ZMR; ZrSiO4; active silicon layers; atmospheric pressure chemical vapor deposition; crystalline silicon carbide; encapsulation; open circuit voltages; potential production costs; silicon crystals; silicon thin-film solar cells; twin grain boundaries; zircon ceramics; zone melting recrystallization; Ceramics; Epitaxial growth; Photovoltaic cells; Silicon; Silicon carbide; Substrates; crystalline silicon thin-film solar cells; low-cost ceramics; zone-melting recrystallization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th
  • Conference_Location
    Tampa, FL
  • Type

    conf

  • DOI
    10.1109/PVSC.2013.6744489
  • Filename
    6744489