• DocumentCode
    683184
  • Title

    Analyzing impact of background plating from alkaline Ni bath for Ni-Cu metallization

  • Author

    Raval, Mehul C. ; Joshi, Akanksha ; Solanki, Chetan Singh

  • Author_Institution
    Dept. of Energy Sci. & Eng., Indian Inst. of Technol., Bombay, Mumbai, India
  • fYear
    2013
  • fDate
    16-21 June 2013
  • Firstpage
    2254
  • Lastpage
    2256
  • Abstract
    Ni-Cu based front contacts for c-Si cells are plated on patterned SiNx and there could be undesirable background plating leading to shading and shunting losses. In this work, background plating from an alkaline Ni bath is analyzed by Suns-Voc and CoreScan studies. It has been observed that for plating interval of two minutes, pseudo fill-factor show variations till 67% and average Rsh value was less than half of unprocessed cells. Decrease in Rsh for plating interval of one minute was not as severe as for two minute plating.
  • Keywords
    copper; electroplating; elemental semiconductors; metallisation; nickel; silicon; solar cells; alkaline nickel bath; background plating impact analysis; nickel-copper metallization; Metallization; Nickel; Photovoltaic cells; Photovoltaic systems; Resistance; Silicon; Background plating; Ni plating; Pseudo fill-factor; Shunt resistance; Suns-Voc;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th
  • Conference_Location
    Tampa, FL
  • Type

    conf

  • DOI
    10.1109/PVSC.2013.6744926
  • Filename
    6744926
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=683184