DocumentCode :
683274
Title :
An improved mathematical modeling to simulate metallization screen pattern trend for silicon solar cell
Author :
Lin Jiang ; Weiming Zhang ; Guo, Tengjiao ; Kapp, David ; Li Yan ; Wang, Lingfeng
Author_Institution :
Photovoltaic Bus. Unit, Heraeus Precious Metals North America Conshohocken, LLC, West Conshohocken, PA, USA
fYear :
2013
fDate :
16-21 June 2013
Firstpage :
2641
Lastpage :
2645
Abstract :
The series resistance calculation based on H-type model has been widely used to understand power loss mechanism in semiconductor solar cell, and one of its popular applications is to predict optimal metallization screen printing pattern. The disadvantage of this model is that it is not accurate to estimate the relationship of screen pattern trend vs. cell efficiency, since it is based on an ideal rectangular finger shape, which does not exist in present regular screen printing process. In this work, a revised model is proposed to simulate the contact resistant power loss in multi-crystalline silicon solar cell. Improved accuracy of the new model is found by comparing the simulation results to the I-V testing data of multi-crystalline silicon solar cell printed with Heraeus 96XX front Ag paste.
Keywords :
elemental semiconductors; integrated circuit metallisation; printing; silicon; solar cells; H-type model; Heraeus 96XX; I-V testing data; Si; cell efficiency; contact resistant power loss resistance; ideal rectangular finger shape; improved mathematical modeling; metallization screen pattern trend analysis; multicrystalline silicon solar cell; optimal metallization screen printing pattern prediction; power loss mechanism; regular screen printing process; revised model; semiconductor solar cell; series resistance calculation; silicon solar cell; Contact resistance; Fingers; Mathematical model; Photovoltaic cells; Resistance; Shape; Silicon; metallization; series resistance; silicon; solar cell;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th
Conference_Location :
Tampa, FL
Type :
conf
DOI :
10.1109/PVSC.2013.6745016
Filename :
6745016
Link To Document :
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