DocumentCode
683387
Title
Reliability of crystalline silicon photovoltaic laminates: Test development and finite element analysis
Author
Athreya, Siddharth Ram ; Sharma, Ritu ; Lokhande, Ashish ; Feist, Rebekah ; Kauffmann, Keith ; Lopez, L. ; Mills, Michael
Author_Institution
Dow Chem. Co., Midland, MI, USA
fYear
2013
fDate
16-21 June 2013
Firstpage
3179
Lastpage
3184
Abstract
The use of finite element analysis (FEA) and lab testing is gaining acceptance within the photovoltaic (PV) industry and is being increasingly used to “design-in” reliability into a product by investigating damage based on anticipated field conditions and environmental stressors. This paper presents a case study on the use of FEA to predict crystalline silicon (c-Si) cell fracture within a laminate subjected to bending loads (analogous to stepping loads during installation and loads experienced under rack-mounting and seasonal wind and snow conditions). Challenges related to development of a material model (that could be incorporated into the FE models) for c-Si cells are discussed. The use of electroluminescence (EL) as a diagnostic technique to detect fracture of c-Si cells within laminates is discussed. Finally, the use of in-situ Voc measurements during three-point bend testing in detecting failure events (in un-aged laminates and those aged under accelerated testing conditions) is also described. This could potentially be a new test method to investigate the effects of accelerated testing on the mechanical integrity of different parts of the electrical assembly such as the cells, weld and solder joints.
Keywords
assembling; elemental semiconductors; finite element analysis; semiconductor device reliability; silicon; solar cells; EL; FE model; FEA; PV industry; Si; accelerated testing condition; anticipated field condition; bending load; cells; crystalline silicon cell fracture prediction; crystalline silicon photovoltaic laminate reliability; design-in reliability; diagnostic technique; electrical assembly; electroluminescence; environmental stressor; failure event detection; finite element analysis; fracture detection; in-situ voltage measurement; lab testing; material model; mechanical integrity; photovoltaic industry; rack-mounting; seasonal wind; snow condition; solder joint; stepping load; test development; three-point bend testing; un-aged laminates; weld; Aging; Glass; Laminates; Load modeling; Silicon; Stress; finite element methods; material testing; photovoltaic systems; reliability; silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th
Conference_Location
Tampa, FL
Type
conf
DOI
10.1109/PVSC.2013.6745129
Filename
6745129
Link To Document