DocumentCode :
683448
Title :
Module interconnection of both sides-contacted silicon solar cells by screen-printing
Author :
Petermann, Jan Hendrik ; Schulte-Huxel, Henning ; Steckenreiter, Verena ; Gogolin, Ralf ; Eidelloth, Stefan ; Dullweber, Thorsten ; Kajari-Schroder, Sarah ; Brendel, Rolf
Author_Institution :
Inst. for Solar Energy Res. Hamelin (ISFH), Emmerthal, Germany
fYear :
2013
fDate :
16-21 June 2013
Firstpage :
3448
Lastpage :
3453
Abstract :
We demonstrate the module interconnection by means of screen printing. The metallization paste is printed over the edge of five heterojunction solar cells. This connects the frontside of a cell to an underlying Al-patterned rear-side contact of the neighboring cell. All cell interconnections are realized in a single printing step. Encapsulated modules reach open circuit voltages up to 683 mV per cell and designated area conversion efficiencies up to 17.0 %. The designated module area is 82 cm2. We eliminate shunts that originate from laser scribing to reach this efficiency. Quantitative dark lock in thermography images and I-V curve modeling of the shunting losses lead the way.
Keywords :
elemental semiconductors; infrared imaging; printing; silicon; solar cells; I-V curve modeling; Si; aluminium-patterned rear-side contact; cell interconnections; encapsulated modules; heterojunction solar cells; metallization paste; module interconnection; open circuit voltages; printing step; quantitative dark lock; screen-printing; shunting losses; sides-contacted silicon solar cells; thermography images; voltage 683 mV; Glass; Integrated circuit interconnections; Lasers; Passivation; Photovoltaic cells; Resistance; Silicon; Hybrid silicon; heterojunction; module interconnection; module level processing; screen-printing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th
Conference_Location :
Tampa, FL
Type :
conf
DOI :
10.1109/PVSC.2013.6745190
Filename :
6745190
Link To Document :
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