Comparative investigation of double-layer and double-side micro-channel cooling for power electronics packaging

Author

Sakanova, Assel ; Shan Yin

Author_Institution

Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore

fYear

2013

fDate

11-13 Dec. 2013

Firstpage

73

Lastpage

77

Abstract

In present work, micro-channel heat sink (MCHS) is integrated inside direct bond copper (DBC) for power electronics cooling. Based on commercial CFD code ANSYS Fluent, micro-channels are designed in back Cu-layer of DBC substrate with liquid water as coolant. Two advanced cooling structures, including double-layer (DL) and double-side (sandwich) micro-channel, are investigated. The sandwich structure with counter flows shows reduction in thermal resistance by 59%, 52% and 53% when compare with single-layer (SL), DL with unidirectional flows and DL with counter flows respectively. It also promises uniform temperature-distribution.

Keywords

computational fluid dynamics; cooling; copper; heat sinks; microchannel flow; power electronics; temperature distribution; thermal management (packaging); thermal resistance; ANSYS Fluent; Cu; advanced cooling structures; commercial CFD code; direct bond copper; double-layer microchannel cooling; double-side microchannel cooling; liquid water; microchannel heat sink; power electronics cooling; power electronics packaging; thermal resistance; uniform temperature-distribution; Cooling; Electronic packaging thermal management; Heat transfer; Radiation detectors; Sandwich structures; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th

Conference_Location

Singapore

Print_ISBN

978-1-4799-2832-3

Type

conf

DOI

10.1109/EPTC.2013.6745687

Filename

6745687