DocumentCode
683625
Title
A mold flow model with method of cells to better understand IC packaging
Author
Low, B.Y. ; Teh, Susanto ; Pei-Fan Tong ; Zhao, S.F.
Author_Institution
Freescale Semicond., Petaling Jaya, Malaysia
fYear
2013
fDate
11-13 Dec. 2013
Firstpage
255
Lastpage
258
Abstract
A mold flow filling model by using on the concepts of method of cells and the principles of transport phenomena is developed to understand the mold flow and the forces on die/flag. A model representation for a LQFP package has been developed. It is user friendly to study the flow behavior of LQFP package with various downset. In a separate study, a parametric DOE study using FEM (Finite Element Method) MOLD FLOW model was conducted to understand the flow pattern as effect of package size, flag size, die size and downset.
Keywords
finite element analysis; integrated circuit packaging; moulding; FEM; IC packaging; LQFP package; finite element method; mold flow filling model; mold flow model; parametric DOE study; Equations; Finite element analysis; Force; Mathematical model; Viscosity; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
Conference_Location
Singapore
Print_ISBN
978-1-4799-2832-3
Type
conf
DOI
10.1109/EPTC.2013.6745723
Filename
6745723
Link To Document