• DocumentCode
    683848
  • Title

    Study on SF6 decomposition characteristics under thermal fault and its representation method

  • Author

    Jianyu Pan ; Ju Tang ; Qiang Yao ; Cunchao Wang ; Fuping Zeng

  • Author_Institution
    State Key Lab. of Power Transm. Facilities & Syst. Security & New Technol., Chongqing Univ., Chongqing, China
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    73
  • Lastpage
    76
  • Abstract
    SF6 electrical equipments always occur thermal fault developed from local overheating by poor contact. To find out SF6 decomposition characteristics under thermal fault temperature and improve the method of using the decomposed components of SF6 to indentify electrical fault, this paper exploited SF6 thermal decomposition model to conduct serials of experiments. This paper firstly revealed the SF6 thermal decomposition initial temperature. Then it found out the types of decomposed components, analyzed their formation regularity and identified the most stable characteristic components in SF6 thermal decomposition. Finally, a representation method was established by using characteristic component to represent the thermal fault information. The results show that: SF6 begins to decompose at 300°C and it contains CO2, SO2F2, SOF2, SOF4, SO2 and H2S, but no CF4; the improvement of fault temperature will promote the formation of decomposed components, but the influence regularity of each component is different; the established correlation picture and diagnosis table can effectively represent SF6 fault temperature information.
  • Keywords
    SF6 insulation; fault diagnosis; power apparatus; pyrolysis; SF6 decomposition characteristics; SF6 electrical equipments; SF6 fault temperature information; SF6 thermal decomposition model; correlation picture; decomposed component formation; decomposed components; diagnosis table; electrical fault identification; formation regularity; local overheating; representation method; thermal fault information; thermal fault temperature; Fault diagnosis; Sulfur hexafluoride; Temperature; Temperature measurement; Thermal conductivity; Thermal decomposition;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CEIDP.2013.6747081
  • Filename
    6747081