DocumentCode
683848
Title
Study on SF6 decomposition characteristics under thermal fault and its representation method
Author
Jianyu Pan ; Ju Tang ; Qiang Yao ; Cunchao Wang ; Fuping Zeng
Author_Institution
State Key Lab. of Power Transm. Facilities & Syst. Security & New Technol., Chongqing Univ., Chongqing, China
fYear
2013
fDate
20-23 Oct. 2013
Firstpage
73
Lastpage
76
Abstract
SF6 electrical equipments always occur thermal fault developed from local overheating by poor contact. To find out SF6 decomposition characteristics under thermal fault temperature and improve the method of using the decomposed components of SF6 to indentify electrical fault, this paper exploited SF6 thermal decomposition model to conduct serials of experiments. This paper firstly revealed the SF6 thermal decomposition initial temperature. Then it found out the types of decomposed components, analyzed their formation regularity and identified the most stable characteristic components in SF6 thermal decomposition. Finally, a representation method was established by using characteristic component to represent the thermal fault information. The results show that: SF6 begins to decompose at 300°C and it contains CO2, SO2F2, SOF2, SOF4, SO2 and H2S, but no CF4; the improvement of fault temperature will promote the formation of decomposed components, but the influence regularity of each component is different; the established correlation picture and diagnosis table can effectively represent SF6 fault temperature information.
Keywords
SF6 insulation; fault diagnosis; power apparatus; pyrolysis; SF6 decomposition characteristics; SF6 electrical equipments; SF6 fault temperature information; SF6 thermal decomposition model; correlation picture; decomposed component formation; decomposed components; diagnosis table; electrical fault identification; formation regularity; local overheating; representation method; thermal fault information; thermal fault temperature; Fault diagnosis; Sulfur hexafluoride; Temperature; Temperature measurement; Thermal conductivity; Thermal decomposition;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
Conference_Location
Shenzhen
Type
conf
DOI
10.1109/CEIDP.2013.6747081
Filename
6747081
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