• DocumentCode
    683866
  • Title

    Study on the extension process of AC local arc on wet contaminated insulating surface

  • Author

    Li Yawei ; Zhang Qiaogen ; Yang Xiaolei ; Zhou Jun ; Yu Xinzhe

  • Author_Institution
    High Voltage Dept., Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    331
  • Lastpage
    333
  • Abstract
    In order to research the extension processes of local arc on wet contaminated insulating surface under AC voltages, high speed camera was used to track the extension process, while, the voltage and leakage current waveforms were recorded by the measurement system. measurement systemObservationally, the extension process can be divided into two categories - The arc foot moving forward along the wet contaminated surface and the arc floating through air. In the case of applied voltage was low, the arc foot extension process was suppressed as the electric field ahead was limited. Arc length went on increasing as it was floating more seriously. When the applied voltage approach or reach flashover voltage, the fast extension of arc foot result in flashover rapidly, and the partial arc didn´t had much time to float up. This also indicated that the extension of arc foot was only the result of arc propagation like arc floating instead of surface electric breakdown due to electric field concentration.
  • Keywords
    arcs (electric); cameras; contamination; flashover; insulation; leakage currents; AC local arc extension process; AC voltages; arc floating; arc foot extension process; arc length; electric field; electric field concentration; flashover voltage; high speed camera; leakage current waveforms; measurement system; surface electric breakdown; wet contaminated insulating surface; Current measurement; Electric fields; Electrodes; Flashover; Foot; Leakage currents; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CEIDP.2013.6747106
  • Filename
    6747106