• DocumentCode
    683878
  • Title

    Electrical tree formation as a measure of degradation resistance in polymeric materials for HVDC applications

  • Author

    Le Wang ; Xiangrong Chen ; Libin Hu ; Gubanski, Stanislaw ; Blennow, J??rgen

  • Author_Institution
    Dept. Mater. & Manuf. Technol., Chalmers Univ. of Technol., Gothenburg, Sweden
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    510
  • Lastpage
    513
  • Abstract
    In the framework of elaborating a methodology for testing the resistance to electrical treeing of polyethylene (PE) for HVDC applications, electrical tree inception tests were performed before and after a thermal ageing on XLPE samples. For this purpose test objects of wire-plane electrode geometry were exposed to various voltage regimes. The obtained results show that a DC pre-stress followed by an application of voltage pulses of opposite polarity appeared most successful for a repeatable inception of electrical trees in the studied materials. Thin tree filaments were formed, distributing randomly at the vicinity of the wire electrode (i.e. high voltage electrode). More trees and longer branches were found in the samples having longer thermal ageing period. These results correlate well with results of in parallel performed tree inception tests under AC voltage ramping. It is therefore postulated that an AC electrical tree inception test can successfully be used for evaluating degradation resistance of materials for HVDC applications.
  • Keywords
    HVDC power transmission; XLPE insulation; ageing; polymers; trees (electrical); AC electrical tree inception test; AC voltage ramping; DC pre-stress; HVDC applications; XLPE samples; degradation resistance; electrical tree formation; opposite polarity; polyethylene; polymeric materials; thermal ageing; voltage pulses; wire electrode; wire-plane electrode geometry; Aging; Electrodes; HVDC transmission; Materials; Microscopy; Resistance; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CEIDP.2013.6747433
  • Filename
    6747433