• DocumentCode
    683897
  • Title

    Investigation on breakdown properties of low-density polyethylene / nano-ZnO composites

  • Author

    Yujia Cheng ; Ning Guo ; Ruoshi Wang ; Xiaohong Zhang

  • Author_Institution
    Key Lab. of Eng. Dielectr. & its Applic., Harbin Univ. of Sci. & Technol., Harbin, China
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    830
  • Lastpage
    833
  • Abstract
    The dielectric properties of Nano-composites has attract tremendous attention during the past decade. In present paper, the silane coupling agent (KH-570) and titanate coupling agent (105, 101, TC-F) is used as modifiers. The nanometer zinc oxide which has been modified by KH-570 or TC-F etc is added to the low density polyethylene. In the end, the electrical breakdown properties of the composites are investigated. The test results show that when the content of nano-ZnO was 3%, breakdown field strength of the composites is higher than origin LDPE 11%. The smaller ZnO particles in size, the higher breakdown strength of the nano-composite with the same content of nano-ZnO is. The breakdown strength of nano-composites with nano-ZnO which is treated by silane coupling agent (KH-570) is higher than those with nano-ZnO treated by titanate coupling agent. It can be found that combination of nanometer zinc oxide and polyethylene macromolecular chain is effectively improved by infrared spectrum.
  • Keywords
    electric breakdown; nanocomposites; polyethylene insulation; zinc compounds; KH-570; LDPE; TC-F; ZnO; breakdown field strength; dielectric properties; electrical breakdown properties; infrared spectrum; low density polyethylene; nanoZnO; nanocomposites; nanometer zinc oxide; polyethylene macromolecular chain; silane coupling agent; titanate coupling agent; Composite materials; Couplings; Electric breakdown; Polyethylene; Zinc oxide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CEIDP.2013.6747463
  • Filename
    6747463