DocumentCode :
684107
Title :
Thermally stimulated current and dielectric studies of liquid crystal composites
Author :
Naikui Gao ; Chun Wu ; Wenxi Zhang ; Chi Chen ; Haiyun Jin ; Wentao Ji
Author_Institution :
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
fYear :
2013
fDate :
20-23 Oct. 2013
Firstpage :
210
Lastpage :
213
Abstract :
Recently, composite materials of liquid crystal polymer (LCP) and inorganic filler attracted the attention of the electrical industry. In this research, the relationships between thermally stimulated current (TSC) of liquid crystal (LC) composites and the polarization temperature (Tp), polarization voltage (Vp) and heating rate (β) were investigated respectively. The variation of trap levels and trapped charges under different experimental conditions were calculated and analyzed. Trap levels of the peaks in temperature range (-60°C~150°C) were about 0.2eV, 0.9~1.5eV and 2.0~2.5eV. In addition, the dielectric spectrum test was performed on LC composites. Permittivity (εr) changed little (3.4~3.9) in frequency range of 20Hz~106Hz and temperature range -60°C ~100°C, but increased sharply when temperature was above 140°C. The values of loss (tanδ) increased sharply in low frequencies (≤ 20Hz) and high temperatures (≥ 130°C) region. The peak of tanδ shifts to higher temperatures with frequency increasing and to higher frequencies with temperature increasing.
Keywords :
composite insulating materials; composite materials; liquid crystal polymers; permittivity; LCP; TSC; composite materials; dielectric spectrum test; electron volt energy 0.9 eV to 1.5 eV; electron volt energy 2.0 eV to 2.5 eV; frequency 20 Hz to 106 Hz; inorganic filler; liquid crystal composites; liquid crystal polymer; polarization temperature; polarization voltage; temperature -60 degC to 150 degC; thermally stimulated current; trap levels; trapped charges; Dielectrics; Heating; Materials; Spectroscopy; Temperature distribution; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
Conference_Location :
Shenzhen
Type :
conf
DOI :
10.1109/CEIDP.2013.6748149
Filename :
6748149
Link To Document :
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