• DocumentCode
    684182
  • Title

    A preliminary study on the impact of environment to the heat of insulator

  • Author

    Ruihai Li ; Kangtai Xu ; Fuzeng Zhang ; Zhuo Xu ; Youping Tu ; Bo Gong

  • Author_Institution
    Electr. Power Res. Inst., Southern Power Grid (Group) Co., Ltd., Guangzhou, China
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    415
  • Lastpage
    417
  • Abstract
    Infrared temperature measurement technology is becoming increasingly applied in the detection of composite insulator defects. However, most evaluations of the operation condition of the insulators are based solely on the temperature rise without giving consideration to the factors of the environment, especially the temperature and humidity that the composite insulator is in. This paper focuses on the influence of temperature and humidity to temperature rise of the insulator and includes the study of a batch of overheating insulators from a transmission line. Differences are present in infrared temperature test results acquired from both the actual sites and in laboratories. Apart from this, the infrared test results change under various temperature and humidity in laboratory experiments. Therefore, taking consideration of the test environment is important in determining the degree of temperature rise. At last, suggestions on infrared detection are provided to guide testing at actual sites.
  • Keywords
    humidity; infrared detectors; insulators; power transmission lines; temperature measurement; composite insulator defects; environment impact; humidity; infrared detection; infrared temperature measurement; infrared temperature test; insulator heat; laboratory experiments; overheating insulators; test environment; transmission line; Heating; Humidity; Insulators; Laboratories; Power transmission lines; Temperature; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CEIDP.2013.6748271
  • Filename
    6748271